瞬时液相焊接高温合金接头的显微结构表征
张 怡，程永鑫，陈春林*，贺连龙，高振桓，叶恒强瞬时液相焊接高温合金接头的显微结构表征
张 怡，程永鑫，陈春林*，贺连龙，高振桓，叶恒强
(1.中国科学院金属研究所 沈阳材料科学国家研究中心,辽宁 沈阳110016; 2.中国科学技术大学 材料科学与工程学院，辽宁 沈阳110016;3.季华实验室，广东 佛山528200; 4.长寿命高温材料国家重点实验室, 四川 德阳 618000)
摘 要 瞬时液相焊接(TLP连接)是一种极具应用价值的高温合金连接和修复方法。本文对1230℃下使用Ni-Cr-B中间层对镍基高温合金Mar-M247进行瞬时液相焊接的接头进行了显微结构表征，研究了由非等温凝固区(NSZ)、等温凝固区(ISZ)和扩散影响区(DAZ)组成的接头组织和沉淀相析出行为。研究结果表明：NSZ中析出相主要为M23(C, B)6和γ/γ’组成的共晶组织，其中伴生少量块状MC碳化物；与NSZ相邻的ISZ则由γ/γ’相组成；DAZ中的主要析出相为颗粒状和针状M5B3型硼化物，并伴生少量长直鱼骨状和不规则块状的M5B3型硼化物。更长的焊接保温时间会更有利于等温凝固过程，对样品进行焊后热处理可使接头组织更加均匀。
关键词 镍基高温合金；瞬时液相焊接；微观组织；硼化物；碳化物
中图分类号：TG146.1+5；TG457.19；TB31；O766+.1 文献标识码：A doi:10.3969/j.issn.1000-6281.2023.05.003
Microstructure characterization of transient liquid phase bonding superalloy joints
ZHANG Yi1，2, CHENG Yong-xin1, CHEN Chun-lin1，3*, HE Lian-long1, GAO Zhen-huan4, YE Heng-qiang3
(1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang Liaoning 110016; 2. School of Material Science and Engineering, University of Science and Technology of China, Shenyang Liaoning 110016; 3. Ji Hua Laboratory, Foshan Guangdong 528200; 4. State Key Laboratory for Long-life High Temperature Materials, Deyang Sichuan 618000, China)
Abstract Transient liquid phase (TLP) bonding is a promising joining and repairing processof Ni-based superalloys. In this paper, the microstructure of the TLP bonded joints of Mar-M247 with Ni-Cr-B amorphous interlayer at 1230 ℃ was systematically characterized. The microstructure and precipitation behavior of the joints composed of non-isothermal solidification zone (NSZ), isothermal solidification zone (ISZ) and diffusion affected zone (DAZ) were studied. The results show that the main precipitated phases in NSZ are eutectic structures composed of M23(C, B)6 and γ/γ’, accompanied by a small amount of block MC-type carbides. The ISZ adjacent to NSZ is composed of γ/γ’. The main precipitated phases in the DAZ are granular and acicular M5B3-type borides, and a small amount of long straight fishbone-like and irregular block-like M5B3 borides are dispersed. More sufficient holding time in bonding process is conducive to the isothermal solidification process. Post bond heat treatment could be considered to be an effective method for removing these precipitated phases.
Keywords Ni-based superalloy; transient liquid phase bonding; microstructure; borides; carbides
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